JPH0719156Y2 - 樹脂封止型電子部品 - Google Patents
樹脂封止型電子部品Info
- Publication number
- JPH0719156Y2 JPH0719156Y2 JP1989011896U JP1189689U JPH0719156Y2 JP H0719156 Y2 JPH0719156 Y2 JP H0719156Y2 JP 1989011896 U JP1989011896 U JP 1989011896U JP 1189689 U JP1189689 U JP 1189689U JP H0719156 Y2 JPH0719156 Y2 JP H0719156Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- resin
- resin layer
- top surface
- mesa structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 54
- 239000011347 resin Substances 0.000 claims description 54
- 230000005291 magnetic effect Effects 0.000 description 27
- 238000001514 detection method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 230000008646 thermal stress Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005294 ferromagnetic effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007723 die pressing method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Measuring Magnetic Variables (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989011896U JPH0719156Y2 (ja) | 1989-02-03 | 1989-02-03 | 樹脂封止型電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989011896U JPH0719156Y2 (ja) | 1989-02-03 | 1989-02-03 | 樹脂封止型電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02103284U JPH02103284U (en]) | 1990-08-16 |
| JPH0719156Y2 true JPH0719156Y2 (ja) | 1995-05-01 |
Family
ID=31220853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989011896U Expired - Lifetime JPH0719156Y2 (ja) | 1989-02-03 | 1989-02-03 | 樹脂封止型電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719156Y2 (en]) |
-
1989
- 1989-02-03 JP JP1989011896U patent/JPH0719156Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02103284U (en]) | 1990-08-16 |
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Legal Events
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| LAPS | Cancellation because of no payment of annual fees |